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See the Future of Machining Now: Executive Sessions

November 13, 2007
11:00 AM — 1:00 PM
or
1:30 PM — 3:30 PM

Location
TechSolve
6705 Steger Drive
Cincinnati, OH 45237

These sessions are open to any executive at no fee; however, pre-registration (invite-only) is required because space is limited. Each session is limited to 15 attendees.
Please contact me at deshpande[AT]techsolve.org, if you are interested.


Smart Machine Platform Initiative

In an effort to retain and grow the U.S. manufacturing industry, several organizations, including TechSolve, began to take action. Not unlike the game changing technologies that last impacted the manufacturing world, numerical control (NC) in the 1950s and then computer numerical control (CNC) in the 1960s, the Smart Machine Platform Initiative (SMPI) was established to look beyond CNC and into the next game-changing technology—Smart Machines. Smart Machines would have the capability for equipment and process controls to begin to make decisions during the manufacturing process.
SMPI is a five-year effort that is aimed at bringing together research organizations, government laboratories, industry participants, academia, and technology providers to develop, demonstrate, disseminate, and implement smart machine concepts. The program is structured to foster a quick and speedy transition of developed technologies into the U.S. manufacturing infrastructure. SMPI is a partnership with numerous manufacturers, TechSolve, ARDEC and U.S. Army Benet Laboratories.

Agenda

The two-hour session will include a description of the technologies and demonstrations of how the Smart Machining System will impact your bottom-line.
Smart Machining System technologies that will be demonstrated include:
Intelligent Machining: a technology that will virtually simulate the machining processes so that it can generate, verify, and optimize tool paths and cutting conditions in order to achieve maximum performance
On-Machine Probing: an inspection routine where the data is used to make adjustments to the process to minimize non-conforming parts All demonstrations will be conducted in TechSolve’s state of the art testing facility the M. Eugene Merchant Technology Development Center.
These sessions are open to any executive at no fee; however, pre-registration (invite-only) is required because space is limited. Each session is limited to 15 attendees.
Please contact me at deshpande[AT]techsolve.org, if you are interested.

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